PLC光分路器芯片

 

 

 

产品特点/Feture

♦ 低成本、高稳定性

♦ 低偏振相关损耗

♦ 全面满足行业产品性能与可靠性标准

 

应用/Application

♦ FTTH/FTTR光网络

♦ 光信号传输于处理设备

 

主要规格

 

1XN 等分系列光分路器芯片

Item Name

Unit

1x2

1x3

1x4

1x6

1x8

1x12

1x16

1x24

1x32

1x64

Max Insertion Loss @1310nm-1550nm

dB

3.5

5.6

6.6

8.8

9.8

11.8

12.9

15.3

16.1

19.4

Max Insertion Loss @1260-1650nm

dB

3.6

5.8

6.8

9

10

12

13.1

15.5

16.3

19.6

Return loss

dB

55

55

55

55

55

55

55

55

55

55

(1260~1650nm) (max)

Uniformity (max)

dB

0.4

0.5

0.6

0.6

0.6

0.7

0.8

1

1.2

1.5

Directivity (max)

dB

60

60

60

60

60

60

60

60

60

60

PDL (max)

dB

0.2

0.2

0.2

0.2

0.2

0.2

0.2

0.25

0.25

0.25

Pitch

um

250

250

250

127

127/250

127

127

127

127

127

Chip Size (L±0.5xW±0.1xH±0.15)

mm

8.7x1.55x2.1

9.0x1.55x2.1

9.8x1.55x2.1

11.9x1.55x2.1

10.9x1.5x2.1

13.9X2.3X2.1

15.8x1.9x2.1

14.6x2.4x2.1

20.9X3.51X2.1

18.35x4.6x2.1

25.5x9x2.1

Storage condition 

 

-40~85℃

Operation Temperature

 

-40~85℃

 

 

2XN 等分系列光分路器芯片

Item Name

Unit

2x2

2x4

2x8

2x16

2x32

Max Insertion Loss(P)/(S)

 

dB

3.90/4.10

7.00/7.20

10.20/10.40

13.50/13.70

16.70/17.00

Return loss (max)

dB

55

55

55

55

55

Directivity (max)

dB

55

55

55

55

55

Uniformity (max)(P)/(S)

dB

0.80/1.00

0.90/1.10

1.00/1.20

1.20/1.50

1.50/1.80

PDL (max)(P)/(S)

dB

0.20/0.25

0.20/0.25

0.25/0.30

0.30/0.35

0.30/0.35

Pitch

um

250

250

127

127

127

Chip Size (L±0.5xW±0.1xH±0.15)

mm

10.3X1.55X2.1

14.2X1.75X2.1

15.3X1.75X2.1

23.7X2.4X2.1

25.4X4.4X2.1

Wavelength range

1260nm~1650nm

 

 

 

1XN不等分系列光分路器芯片

Item Name

Unit

1x5

1x5

1x5

1x9

1x9

1x9

1x17

75%

25%/4

70%

30%/4

85%

15%/4

50%

50%/8

60%

40%/8

70%

30%/8

70%

30%/16

Max IL @1260-1650nm

dB

1.7

13.3

2

12.5

1.4

15.4

3.5

13.6

2.4

14.8

1.9

15.9

1.9

19.3

Return loss(max)

dB

55

55

55

55

55

55

55

Directivity (max)

dB

60

60

60

60

60

60

60

PDL (max)

dB

0.2

0.2

0.2

0.2

0.2

0.2

0.25

Pitch

um

127

127

250

127

127

127

127

Chip Size (L±0.5xW±0.1xH±0.15)

mm

10.1X1.5X2.1

10.1X1.5X2.1

13.5x1.5x2.1

15.8x1.5x2.1

15.8x1.5x2.1

15.8x1.5x2.1

19.0X2.7X2.1

Storage condition

 

-40~85℃

Operation Temperature

 

-40~85℃